公司简介

    

     

      

   深圳斯普瑞溙科技有限公司供应半导体测试爪测试片金手指golden finger contact pin测试爪金手指销售,测试爪金手指定制,优质试爪金手销售,试爪金手指厂家多种试耗材定制与供应橡胶吸嘴销售,橡胶吸嘴厂家,橡胶吸嘴供应,橡胶吸嘴价格,橡胶吸嘴定制,电木吸嘴常温橡胶吸嘴高温橡胶吸嘴,电木吸嘴,陶瓷吸嘴,吸嘴厂家,封装测试设备备件。。。


    我们公司的产品特点:设计,研发和生产各种测试爪/片金手指,中外合资,规格齐全,价格实惠,性比价高,质量可靠,可单独为客户特殊设计与生产。


      深圳斯普瑞溙科技有限公司是一家专业从事半导体后道封装测试贴片及邦定工艺相关耗材、测试工艺耗材及治具、封装测试设备备件的研发设计、生产、销售于一体的企业。公司成立于2009年。


     公司拥有一个半导体制造技术经验丰富的团队,不定期地与国外进行技术交流,不断地进行新技术、新工艺的开发和改进,使公司在半导体封装测试工艺日新月异的变化中发展壮大,技术得到积累和提升。随着半导体封装测试加工向超薄,超小的方向发展,对相关的辅助工装治具及工艺的要求越来越高,公司通过使用新的材料,研发设计革新相关辅助治具,提出工艺改进建议,与客户一起携手解决遇到的技术难题,使客户在低成本,高效率中赢得市场,达到双赢效果。


      公司凭借优秀的技术团队,高品质的产品,准时的交货,优质的客户服务,合理的价格,已经与诸多的国际,国内的IC封装厂商建立了长期的合作关系,赢得了客户的认可。


我们提供的产品及服务如下:

1)贴片及邦定工艺耗材:陶瓷吸嘴,常温橡胶吸嘴,高温橡胶吸嘴,电木吸嘴,引线框架吸嘴,顶针,点胶头,点胶针,打火杆。

2)测试工业耗材及治具:各种封装系类的测试爪/片(QFN,DFN,SOP,DIP,SOT,SOD,TO-XXX),测试座及POGO PIN,(BGA,QFN,DFN,QFP,FLIP CHIP)

3)封装测试设备备件(ISMECA,ASM,ESEC,OE,MUHLBAUER)  

公司网址:http://www.springtech.com.cn/  


  Shenzhen Springtech Technology Co., Ltd ,founded in 2009,is a professional supplier of semiconductor assembly and test tooling parts . Our main areas of focus are die bond , wire bond ,testing processes and the related equipment spare parts . We have our own capability in design , manufacturing and assembly in the various fields of the Semiconductor Industry .  


  Springtech has a team of people with rich experience in semiconductor manufacturing . As a technology company , we recognize the importance of technique and innovation . Therefore we place a high priority in areas of co-operation with overseas partners and embrace new technology , process development moving towards smaller and thinner devices , it is a great challenge for the related manufacturing tools . We are ready to take on these challenges and provide solutions using our core techniques , new materials and process development . In short .we hope to help our customers achieve their targets efficiently with low cost and high quality , enabling all parties to be in a win-win situation .

   With our continuous efforts to pursue technique innovation , high quality , on-time delivery , customer satisfaction with competitive pricing , we managed to establish long-term co-operation with many IC assembly companies, gaining a soild reputation and recogntion from the industry.


Range of products/services:

1.Die Bond/Wire Bond tooling:

 - Ceramic collect tip , rubber tip , high temperature rubber tip , Vespel tip , Lead Frame suction cup , Die ejector needle , Epoxy dispensing nozzles , EFO body .

2.Testing tools:

 - (for all package types)Contact Fingers , pogo pin , test socket.

3.Spare parts :

 - Machine spare parts for ISMECA , ASM , SRM , ESEC , OE , MUHLBAUER and more.





 
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